Ir al contenidoIr al pie de página
  • Empleos
  • Empresas
  • Sueldos
  • Para empleadores

      Impulsa tu carrera profesional

      Averigua cuánto podrías ganar, encuentra el empleo perfecto y comparte información sobre tu vida laboral y personal de forma anónima.

      employer cover photo
      employer logo
      employer logo

      Intel Corporation

      Empleador activo

      Información
      Evaluaciones
      Pago y prestaciones
      Empleos
      Entrevistas
      Entrevistas
      Búsquedas relacionadas: Evaluaciones de Intel Corporation | Empleos en Intel Corporation | Sueldos en Intel Corporation | Prestaciones en Intel Corporation
      Entrevistas en Intel CorporationEntrevistas para el cargo de Senior Packaging Engineer en Intel CorporationEntrevista en Intel Corporation


      Glassdoor

      • Acerca de
      • Premios
      • Blog
      • Contacto

      Empleadores

      • Cuenta de empleador gratuita
      • Centro de empleador

      Información

      • Ayuda
      • Pautas
      • Condiciones de uso
      • Privacidad y opciones de anuncios
      • No vender ni compartir mi información
      • Herramienta de autorización de cookies

      Trabaja con nosotros

      • Anunciantes
      • Oportunidades laborales
      Descargar aplicación

      • Buscar por:
      • Empresas
      • Empleos
      • Ubicaciones

      Copyright © 2008-2026. Glassdoor LLC. "Glassdoor", "Worklife Pro", "Bowls" y sus logotipos son marcas comerciales registradas de Glassdoor LLC.

      Empresas seguidas

      Sigue a tus empresas favoritas para estar al tanto de las últimas oportunidades y disponer de información desde adentro.

      Búsquedas de empleo

      Recibe recomendaciones y actualizaciones personalizadas al iniciar tu búsqueda.

      Entrevista para Senior Packaging Engineer

      6 nov 2015
      Candidato de entrevista anónimo
      Chandler, AZ

      Otras evaluaciones sobre las entrevistas para el cargo de Senior Packaging Engineer en Intel Corporation

      Entrevista para Senior Packaging Engineer

      11 feb 2019
      Candidato de entrevista anónimo
      Chandler, AZ
      Sin ofertas
      Sin ofertas
      Experiencia negativa
      Entrevista difícil

      Solicitud

      Me postulé en línea. El proceso tomó 1 día. Acudí a una entrevista en Intel Corporation (Chandler, AZ) en jul 2015

      Entrevista

      Onsite interview. But they never sent me an agenda. So on the interview day, I didn't even know when I would give a presentation or who would interview me or how many people I would expect to talk to. The interview started with one on one interview. (strange, isn't it?) After I interviewed with all managers and director, my host took me to another building to interview with VP. But VP didn't show up. So my host took me back and then I gave an 1 hour presentation to 3 people (my host, a manager and my HM). The manager asked me a lot of unrelated background questions. I don't work in that area. I don't know all the answers. But he kept asking even I told him I was not working in that area. HM was not even listening. Her computer had some problems that she could not even login. So she was dealing with that computer all time long till the end of my presentation. Very unprofessional! After I came back, I sent a thank you letter to everyone, but didn't hear back. After 4 weeks, I sent out a followup to HM, and didn't hear back. Another week later, I received a rejection email sent by the application system.

      Preguntas de entrevista [1]

      Pregunta 1

      What is enthalpy
      Responder pregunta
      1
      Experiencia positiva
      Entrevista promedio

      Solicitud

      Me postulé a través de una facultad o universidad. El proceso tomó 4 semanas. Acudí a una entrevista en Intel Corporation (Chandler, AZ) en dic 2018

      Entrevista

      I interviewed with two teams back-to-back. The first team was Materials Technology Development with whom I interviewed from 8am-2pm including 1 hr of lunch in between. There was no presentation and all the interviews which lasted from 30 minutes- 1hr were focused on my PhD research. There was one technical round in which I was asked questions related to stresses in packaging. The second team was Module engineering with whom I interviewed from 2pm - 6pm including first 1 hour of my presentation. The questions in all the interviews from this team were completely behavioral.

      Preguntas de entrevista [1]

      Pregunta 1

      How do you deal with stress? (Module Engineering)
      Responder pregunta

      Entrevista para Senior Packaging Engineer

      17 jul 2015
      Candidato de entrevista anónimo
      Phoenix, AZ
      Sin ofertas
      Experiencia neutra
      Entrevista promedio

      Solicitud

      Me postulé en línea. El proceso tomó 2 semanas. Acudí a una entrevista en Intel Corporation (Phoenix, AZ) en jun 2015

      Entrevista

      Phone Interview, Followed by on-site, The whole process took 2 weeks. The onsite interview included 7 interviews in total, one after the other in a very busy schedule. They also ask me to do a one hour interview about my research. The interviewers were nice and friendly but the whole thing felt rush.

      Preguntas de entrevista [1]

      Pregunta 1

      Tell me about your research
      Responder pregunta