Me postulé a través de una facultad o universidad. El proceso tomó 1 día. Acudí a una entrevista en Intel Corporation
Entrevista
Was invited to an interview on their facility. Initial meeting was friendly. They went straight into technical questions in another room with a whiteboard. Grilled me hard and poor reception.
Preguntas de entrevista [1]
Pregunta 1
Asked 3-5 questions. The questions were beyond my skillset at that point in time. They took poor consideration in making applicable questions based on my skills. First two questions were about digital logic, which I had not taken. The last question was creating code about a deck of cards.
Acudí a una entrevista en Intel Corporation (San Jose, CA)
Entrevista
Pretty straightforward. Few technical questions, but focus is on behavioral traits. Took less than a month from interview to offer. Phone interview, then onsite interview with 4-5 people, including lunch break with potential colleague.
Me postulé en línea. Acudí a una entrevista en Intel Corporation (Washington, DC)
Entrevista
It was easy although I had too much stress it was easier than I thought. It only required self-confidence and awareness. They are professional and I love the company's culture.
Me postulé en línea. El proceso tomó 1 semana. Acudí a una entrevista en Intel Corporation (Hillsboro, OR) en jul 2023
Entrevista
Semi Difficult - Interactive - Phone / Video interview - Technical - Overall skillset match - VLSI - PDK development - ASIC - Latest technology - Previous employment.
The interview process at Intel for an Application Engineer role in TD was a very well executed process. It was quick and simple. I sent my resume in conference to the director and also got a face-to-face (virtual in my case) interview. I went into as much detail as I could.
Preguntas de entrevista [1]
Pregunta 1
ASIC / VLSI domain / Physical Design related questions