Having 3 rounds of interview. Questions based on system verilog,UVM and PCIe. SV and UVM questions were too easy for experienced people. Also He asked some scripting related questions. Also he asked verification flow based questions.
Me postulé a través de un reclutador. El proceso tomó 2 días. Acudí a una entrevista en Wafer Space (Bengaluru) en mar 2016
Entrevista
1. Initial level of telephonic discussion with HR. After this discussion HR scheduled a telephonic discussion round. Telephonic technical round by a Manager. The imphasis was on technical in-depth understanding, out of box thinking, creative ideas etc. It was followed by a Face to face Technical Round. Finally Face to face technical round at client location.
Preguntas de entrevista [1]
Pregunta 1
1. How did my out of box thinking helped to develop a more scalable product/feature.