A total of 3 Rounds were conducted The 3 rounds were: The first round was a Written Aptitude test, the next round was a Technical Round were they focused completely on core topics of my domain. The final round was a HR Round.

The interview process was comprised of three rounds, including two technical interviews and one HR interview. The technical interviews were highly focused on core electronics concepts, particularly revolving around microprocessors and microcontrollers. These sessions tested not only theoretical knowledge but also practical understanding and problem-solving skills related to the design, architecture, and functionality of these key components. The interviewers delved deep into topics like instruction sets, interfacing, real-time applications, and debugging techniques, aiming to evaluate proficiency in handling intricate electronics challenges. Finally, the HR round assessed soft skills, cultural fit, and overall alignment with the organization's goals and values, completing the comprehensive evaluation process.