There was a verbal test and no aptitude test as my GPA was above 8.25. There were three rounds in the interview process. Technical, managerial and HR rounds. All three HRs were sweet and obliging. As i was being interviewed for the EIS profile, basic electronics questions were asked and was asked to explain my projects. It went on smoothly. In the managerial round i was asked to introduce myself and the reason why i preferred TCS and also my strengths and weaknesses and a few illustrations regarding the same. HR round was almost like a formality..same questions that were asked in the managerial round were asked and was given a heads up regarding the 2 year bond and the fee to be paid to break it.