1.written test(digital electronics, verilog,coding), 2.technical interview(digital electronics, verilog , coding, sv, c, computer architecture). 1.written test(digital electronics, verilog,coding), 2.technical interview(digital electronics, verilog , coding, sv, c, computer architecture). 1.written test(digital electronics, verilog,coding), 2.technical interview(digital electronics, verilog , coding, sv, c, computer architecture). 1.written test(digital electronics, verilog,coding), 2.technical interview(digital electronics, verilog , coding, sv, c, computer architecture)

Multiple rounds of interview process - Basic SV/UVM in initial rounds(constraints, coverage, polymorphism, copy, code logics) - Project-based and system-level in advanced rounds - coding skill test and logical thinking skills are must required to crack interview.