Me postulé a través de otra fuente. Acudí a una entrevista en Rennova Solutions (Bengaluru) en ene 2019
Entrevista
2 rounds technical,then HR round,2 year bond will be there.2 rounds technical,then HR round,2 year bond will be there.2 rounds technical,then HR round,2 year bond will be there.2 rounds technical,then HR round,2 year bond will be there.