Me postulé en línea. El proceso tomó 2 meses. Acudí a una entrevista en Qualcomm (Cambridge, East of England, England) en ago 2022
Entrevista
1 phone interview, then 1 initial interview with the principal engineer followed by 2 technical one online interview and one onsite, finally HR interview. All the aspect of physical design and some coding and algorithm
4 interviewers.
Basics of physical design /cpu architecture/experience based questions/tcl scripting/timing analysis/block closure /techniques/previous wrk exp/ drc analysis related questions/ tool related questions/ example
Based questions “how would you solve this?” Kind of questions
Preguntas de entrevista [1]
Pregunta 1
Explain the challenges involved in previous tapeout
Me postulé en línea. Acudí a una entrevista en Qualcomm (Austin, TX) en sep 2025
Entrevista
One hour and loop with 5 people each round focusing on eache step of physical design flow and cadence tools. I have a thesis on RISC V low voltage pd so they asked about that more
Acudí a una entrevista en Qualcomm (San Diego, CA)
Entrevista
Application via Qualcomm careers or referral.
Recruiter may reach out for basic screening:
Your background, tools used (ICC2, PrimeTime, RedHawk, etc.)
Areas of expertise: floorplanning, CTS, routing, STA, DRC, EMIR, etc.
Experience with multi-VDD, ECOs, hierarchical designs, colored flows, etc.
Technical Phone Interviews (1–2 rounds)
Each round typically lasts 45–60 minutes.
Preguntas de entrevista [1]
Pregunta 1
Walk me through how you approach floorplanning for a block.
How do you handle placement of macros and standard cells around them?
What considerations go into designing a power grid?
How do you handle multi-VDD domains or level shifters?
What are tie-high and tie-low cells and where are they used?