The interview process had 3 rounds 1. Image processing skills -This was kind of a task. In this round the problem statement was to find the defect in an image by comparing with a given sample image using the histogram plot of no. of pixels vs grey level difference. Two algorithms were given and the students had to predict which algo can be used to detect the defect. The students were interviewed for the approach they applied for reaching the conclusions. 2. Testing the machine- In this they provided a machine which inspect hole defect in a plate. if the hole diameter in plate is >0.5 micrometer the machine discards the plate by marking it cross. otherwise it puts the plate back to the place it picked the plate from. Now the student has to pen down the test cases for this machine to ensure whether the machine is working right or not. 3. I was out after the 2nd one so i dont know about what happened after that but i hope this much information will also help you certainly to crack these rounds. Best of luck...!!