Me postulé a través de una facultad o universidad. El proceso tomó 4 meses. Acudí a una entrevista en Dow en sep 2014
Entrevista
on campus interview, took about an hour, interviewer was really nice and share his own experiences at Dow. The questions are not difficult. They basically follow your resume. Better prepared some graphical abstracts of your research, it will help a lot when you try to explain your work. They also asked behavior questions such as teamwork and leadership but after all those questions are still related with the projects that you have been working on.
Preguntas de entrevista [1]
Pregunta 1
nothing unexpected, most related with research, some behavior questions about collaboration and leadership
Me postulé a través de una recomendación de un empleado. El proceso tomó 2 meses. Acudí a una entrevista en Dow (Shanghái, Shanghai) en may 2019
Entrevista
A 30 minutes interview including 20 mins of presentation and 10 mins of Q&A with 5 leaders headed in the different business units. Questions are mainly about your slides which are required to describe one program you managed. Not very hard.
Me postulé a través de una facultad o universidad. El proceso tomó 2 meses. Acudí a una entrevista en Dow en ago 2018
Entrevista
The campus interview included technical as well as behavioral questions. It was scheduled for 30 minutes. All questions were related to my work and collaborations. After approximately 3 weeks, I received an email for an on-site interview.
Me postulé a través de una facultad o universidad. El proceso tomó 2 semanas. Acudí a una entrevista en Dow en sep 2016
Entrevista
Supposed to be an on-campus interview but I was out of country and had a phone interview instead. 60-minute phone interview - introduce my research experience (about 10 min). And mostly behavioral questions (related to research experiences) for the remaining time. Left about 5 minutes for me to ask questions.
Preguntas de entrevista [2]
Pregunta 1
Describe collaboration experiences and what how you contributed to the project.