The interview process consisted of 3 rounds first round was a group interview, it contained different kinds of 'games' and logical questions. They wanted to test if we could work together, how we comminucate and if you have leadership. The game was like an escape room where you had to solve different kinds of puzzles. The second interview was with the hiring manager and someone from the team, they asked questions about signals and electrical engineering basics, some mathematics questions - they even asked me to draw a function and its derivative. Third round was with the upper manager, it contained personal questions

generally they were asking about characterization (SEM,STEM,etc) and IC fabrication process, FEW Questions were from resume, one puzzle and basic device physics, also they asked about company products whatever they have made.