Me postulé a través de una facultad o universidad. El proceso tomó 2 meses. Acudí a una entrevista en Alloy Product Development (San Francisco, CA) en dic 2018
Entrevista
There was three parts to the interview process. First, they screen you at your university if they have an info-session. Then, they would contact you with some homework to make sure you understand some basic engineering concepts which you would turn back in. Then, they would invite you to present your portfolio at the company with a few people there, they would also give you a technical interview there as well. After that, they would invite you to the final interview where you would present the same thing to a larger group.
Preguntas de entrevista [1]
Pregunta 1
Brainstorm ways of converting linear energy to rotational energy.
Me postulé en línea. Acudí a una entrevista en Alloy Product Development (San Francisco, CA)
Entrevista
After applying online, I was given a design challenge homework assignment. After submitting the assignment I had a brief phone interview, followed by a longer video chat design challenge interview, and finally an on-site with a few panels. Questions were a mix of basic engineering fundamentals (basic thermo, beam bending, etc) and design challenges (align two competent a precisely, design a standing desk).
Me postulé a través de una facultad o universidad. El proceso tomó 2 meses. Acudí a una entrevista en Alloy Product Development (San Francisco, CA) en oct 2018
Entrevista
The interview process began through a homework assignment that was sent through email. Next was an in-person interview with a couple of the engineers working for the company. Finally, there was a final round interview with a larger group of engineers, where I had to present some of the work I have done previously.
Preguntas de entrevista [1]
Pregunta 1
A mix between standard mechanical engineering questions and a brainstorming session. A large part of the interview was based on presenting your work and answering any followup questions that they may have.