QUALCOMM SEMICONDUCTORES Y SISTEMAS AVANZADOS DE BAJA CALIFORNIA
Engineering Group, Engineering Group > Failure Analysis Engineering
General Summary:
The responsibility of this position is to perform Failure Analysis of Semiconductor IC devices. Evaluate the electrical characteristics of systems and/or integrated circuits to determine cause of failure by using Electrical fault isolation tools/techniques. Review of test datalogs from multiple sources will be necessary as part of the investigation. High level of collaboration and interaction with Product Engineering, Design Engineering, Quality Engineering, and Foundry Engineering teams is necessary. Summarize completed analysis work to drive corrective action. The qualified candidate will work individually and in cross-discipline team to analyze design, reliability, yield or field failures down to a physical root cause. The analysis will involve use of various state-of-the-art analytical tools, processing the acquired data and information sets to arrive at a conclusion regarding the cause of failure. Ability to seamlessly support and work with cross-functional multi-national engineering teams.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field.
Primary Responsibilities
Applies advanced knowledge in an area of failure analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing, etc.) to solve problems, and seeks resources from other teams to find alternatives
Hands-on electrical fault isolation analysis by use of static laser techniques XIVA, OBIRCh and Photo Emission Microscopy, Lock-In Thermal microscopy to localize areas of interest and isolate location of defect.
Hand-on advance electrical fault isolation techniques, Dynamic Laser stimulation, thermal and photonic fault injection while interfacing with system level, automated test equipment and bench testing platforms for functional debug.
Skills Requirements
Proficient in various physical and electrical analysis techniques such as mechanical polishing, Chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, OBIRCH/TIVA.
Proficient in tester interface optical fault isolation including Soft Defect Localization, Laser Voltage Probing. Frequency mapping, time resolved emission and thermal mapping,
Familiar with Reliability testing for Device and packaging product qualification including CDM, HBM, TLP, HTOL, BHAST, BURN-IN etc.
Must be a good communicator, have good organization and project management skills, be able to work in a laboratory environment, and be effective getting results by working with multi-functional teams.
Preferred Qualifications
Education:
Masters Electrical Engineering, Microelectronics, Physics related
Work Experiences:
2+ years chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.
Skills:
Automated Test Equipment (ATE), Data Analysis, Failure Analysis, Product Development, Product Reliability
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