Me postulé a través de una facultad o universidad. El proceso tomó 2 días. Acudí a una entrevista en Capgemini Invent en sep 2017
Entrevista
The interview process was quite good and effective. 3 colleges were participating this time. Originally i belonged to Gnit kolkata bt the interview process was for the whole JIS group of engineering colleges.
First day consisted of Aptitude and pseudo code rounds. After that the next day contained the interview and the HR rounds. Aptitude questions were quite easy for me. Apti round came with an addition Essay round. Then pseudo code contained some 20 mins which were to be submitted within 20mins. Pseudo code round was basically Technical mcqs.
After that day, we were called at 10in the morning. The interview was conducted one-on-one. It consisted of basically personality questions and questions that were related to the subjects that was written in the CV. Technical question were asked from the subjects.
After technical round, we were asked to wait for the results. Upon passing the technical interview round, we were called for the HR round.
Overall it was a good experience for a first timer like me :)
Very nice process for the. Interview and it's very easy process well mentioned process and you need to carry is prof for the interview and Mobile is allowed but laptop is not
Me postulé en persona. El proceso tomó 1 día. Acudí a una entrevista en Capgemini Invent (Bangalore Rural) en ene 2024
Entrevista
3 round of interview
2 face to face technical round
1 hr round salary negotiation need to discussion based on the you expection and then company formalities hbfdshb hbfdshab dfhibdasb
Me postulé a través de una agencia de empleos. El proceso tomó 2 meses. Acudí a una entrevista en Capgemini Invent (Londres, Inglaterra) en ago 2023
Entrevista
I was contacted by recruiter, it was followed by 1st stage technical pair programming interview (which I apparently did well) and then the final stage presentation interview where another candidate and me had to build powerpoint presentation.
